Basic Info.
Model NO.
GA Aluminum pcb645
Structure
Metal Base Rigid PCB
Dielectric
Metal Composite Materials
Material
Fr4 Cem1 Cem3 Aluminum
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Production Process
Subtractive Process
Base Material
Fr4/Cem-1/Cem-3/Aluminu
Insulation Materials
Metal Composite Materials
Surface Finishing
HASL\OSP\Immersion Gold
Min. Line Width
0.1mm/4mil
Min. Line Spacing
4/4mil(0.1/0.1mm)
Transport Package
Carton/Vacuum/Bubble Bags/According
Specification
Thickness 0.1~5.0mm
Product Description
Our Services
We can provide one-stop service:
1. PCB circuit boards.
2. E-test.
3.Electronic components purchasing.
4. PCB assembly: available on SMT, BGA, DIP.
5. PCBA function test.
6. Enclosure assembly.
Our factory PCB manufacture capability :
Aluminium Tech Specification Product Capability:
Item | | |
Type of Alum board | single board, Insulation board, double sided board |
Finish Board Thickness | 0.4mm----- 3.0mm |
Copper Thickness | 1 OZ--6 OZ |
Min.Trace Width & Line Spacing | 0.15mm |
Biggest size | 120cm*60cm |
Type for surface treatment | OSP.HASL, Immersion Gold ,Immersion Tin (lead free) |
OSP | 0.20-0.40um |
Thickness of Ni | 2.50-3.50um |
Thickness of Au | 0.05-0.10um |
Thickness of tin | 5-20um |
Thickness of immersion silver | 0.15-0.40um |
Thermal conductivity | 1.0W -----3.0W |
Dielectric Thickness | 50um-150um |
Thermal resistance | 0.05ºC/W -1.7ºC/W |
Minimum completed hole dimension | ±0.10mm |
Tolerance for Hole Diameter | ±0.075mm |
Minimum Drilling Hole Diameter | φ0.8mm |
Mask between pins | 0.15mm-0.35mm |
Minimum spacing between Pad and Pad | 0.18mm-0.35mm |
Outline tolerance | ±0.10mm |
Minimum thickness for V-cut | 0.25mm |
Outside copper thickness | 18-105um |
PCB Manufacture Capacity |
Item | Specification |
Material | FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
Remarks | High Tg CCL is Available(Tg>=170ºC) |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Shape | Routing,Punch,V-cut,Chamfer |
Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
Silkscreen(black, yellow, white) |
Peel able-mask(red, blue, thickness>=300um) |
Minimum Core | 0.075mm(3mil) |
Copper Thickness | 1/2 oz min; 12oz max |
Min Trace Width & Line Spacing | 0.075mm/0.075mm(3mil/3mil) |
Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
Min Hole Diameter for Punching | 0.6mm(35mil) |
Biggest panel size | 610mm * 508mm |
Hole Position | +/-0.075mm(3mil) CNC Drilling |
Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
Non PTHL:+/-0.05mm(2mil) |
Outline Tolerance | +/-0.1mm(4mil) CNC Routing |
Warp & Twist | 0.70% |
Insulation Resistance | 10Kohm-20Mohm |
Conductivity | <50ohm |
Test Voltage | 10-300V |
Panel Size | 110 x 100mm(min) |
660 x 600mm(max) |
Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
6 layers:0.25mm(10mil)max |
Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Flexible PCB product Capacity
FPC Tech Specification |
Items | Capabilities |
Layers | FPC:1 to 6 Layers, Rigid Flex: 2 to 10 Layers |
Regular Base Materials | Kapton,Polyimide(PI), Polyester(PET), FR4 |
Base Copper Thickness | 1/3 oz to 8oz |
Regular Base Material Thickness | 12.5um to 50um(FPC) |
0.1mm to 3.2mm(Rigid) |
Regular Coverlay Thickness | 27um to 50um |
Regular Adhesive Thickness | 12um to 25um |
Blind or Buried Vias | Yes |
Impedance Control | Yes |
Min.Line Width/Spacing | 0.04mm/0.04mm |
Surface Finishing | Electroplate Ni/Au(Flash gold/Soft gold/Hard gold), ENIG, HASL, Immersion Tin,OSP |
Outline Fabrication | Die cut, laser cut, CNC routing, V-scoring |
Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
Edge to edge(Hard tool/Die Cut) | ±0.05/±0.2mm |
Circuit to edge(Hard tool/Die Cut) | ±0.07/±0.2mm |
PCB Assembly(SMT) Product Capacity
SMT Capacity |
SMT Item | Capacity |
PCB Max. size | 510mm*1200mm(SMT) |
Chip component | 0201, 0402, 0603, 0805, 1206 package |
Min.pin space of IC | 0.1mm |
Min. space of BGA | 0.1mm |
Max.precision of IC assembly | ±0.01mm |
Assembly capacity | ≥8 million piots/day |
DIP capacity | 6 DIP production lines |
Assembly testing | Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test) |
FCT(Functional Circuit Test) | Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement. |
LEAD TIME FOR PRODUCTION ORDERS:
| | Sample Lead time | Mass production lead time |
Single sided PCB | 1~3 | 4~7 |
Double sided PCB | 2~5 | 7~10 |
Multilayer PCB | 7~8 | 10~15 |
PCB and Assembly | 8~15 | 15~20 |
OEM/ODM/EMS Services for PCBA:
PCBA, PCB Board assembly: SMT & PTH & BGAPCBA and enclosure designComponents sourcing and purchasingQuick prototypingPlastic injection moldingMetal sheet stampingFinal assemblyTest: AOI, In-Circuit Test (ICT), Functional Test (FCT)Custom clearance for material importing and product exporting
Capability - SMT
Lines 9(5 Yamaha,4KME)Capacity 52 million placements per monthMax Board Size 457*356mm.(18"X14")Min Component size 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFPSpeed 0.15 sec/chip,0.7 sec/QFP
Capability - PTH
Lines 2Max board width 400 mmType Dual wavePbs status Lead-free line supportMax temp 399 degree CSpray flux add-onPre-heat 3
FAQ
Q1:Are you a factory or trade company?
A: Fully Gold International Holdings Liimted is a PCB/FPC/PCBA manufacturer/factory. We specialize in PCB/PCBs Board for 14 years.
Q2:Is my PCB file safe if I send it to you for manufacturing?
A: We respect customer's design authority and will never manufacture PCB for someone else without your permission. NDA is acceptable.
Q3:What payment do you accept ?
A: TT/ Western Union/ Paypal/ Unistream.
Q4: What's your shipping way ?
A: 1. We have our own forwarder to ship goods by DHL, UPS, FEDEX, TNT,EMS.
2. If you have your own forwarder, we can cooperate with them.
Q5: How about the MOQ?
A: For PCB: 1 pc
For PCBA: 1pc
Q: What's your main market?
A:Europe, USA, Brazil, Russia, Turkey, Iran, Australia, Singapore...
Address:
Room126, Building a, Huafeng Mingyou Purchasing Center, Baoyuan Road Xixiang Subdistrict, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory, Trading Company
Business Range:
Electrical & Electronics
Management System Certification:
ISO 9001, ISO 20000, OHSAS/ OHSMS 18001
Company Introduction:
Good Ahead Power Co., Ltd focus on the design and manufacture of various custom parts, included LCD& LCD module, PCB, FR4 spacer, E-paper display and Magnetic parts.
Our company is located in ShenZhen, , China, a city full of vitality and business opportunities, Here, first of all. We have a rapid response, rapid manufacturing and logistics and a convenient advantage, can provide you with efficient supply services. Secondly, we have rich experience in disign, development and manufacturing more than 15 years, and can provide you with quality product improvement, re-implementation and product-related ancillary products services.
Our company has been committed to ensuring the quality of products and meet customer requirements, pay attention to the company′s own integrity and customer feedback. Over the years has been customer support and recognition.
We are promise to provide the best quality and the most satisfied service for our all customers always! ! !
){kind=link}